Analysis of solder joint reliability in flip chip packages

作者：Zhang Xiaowu^*; Cui C Q; Chan K C; Wong E H; Iyer Mahadevan K

来源：International Journal of Microcircuits and Electronic Packaging, 2005, 25(1): 147-159.

• Creep fatigue
• Creep fatigue life prediction model
• Design parameters
• Electronic Packaging
• Flip Chip
• Flip-chip packages
• Main effect
• Non-linear finite-element analysis
• Parametric study
• Solder fatigue
• Solder Joint Reliability
• Solder joints
• Substrate thickness
• Thermal fatigue-life
• Underfill
• Underfill materials

Fatigue damage of solder joints is a serious reliability concern in electronic packaging. In this study, a flip chip package was modeled to investigate the effects of underfill material properties and BT substrate thickness on solder joint reliability. The CTE was found to have the main effect and matching CTE between underfill and solder joint is the most important consideration in the selection of underfill material. This paper also presents a creep fatigue life prediction model for thermal cycling. The model is generated by correlating nonlinear finite element analysis with experimentally measured thermal fatigue lives of flip chip packages. This creep fatigue model may be used in parametric studies assessing the influence of flip chip or FCOB design parameters on solder fatigue life.

• 出版日期2005