Deformation mechanism during dynamic loading of an additively manufactured AlSi10Mg_200C

作者：Hadadzadeh Amir^*; Amirkhiz Babak Shalchi; Li Jian; Odeshi Akindele; Mohammadi Mohsen

来源：Materials Science and Engineering A-Structural Materials Properties Microstructure and Processing, 2018, 722: 263-268.

DOI：10.1016/j.msea.2018.03.014

• Direct metal laser sintering (DMIS)
• Transmission electron microscopy (TEM)
• Electron bacicscattering diffraction (EBSD)
• Dynamic recovery (DRV)
• Dynamic recrystallization (DRX)

A DMLS-AlSi10Mg_200C was subjected to dynamic loading at two strain rates. At 1680 s(-1), an ultrafine substructure formed inside the alpha-Al dendrites due to dynamic recovery (DRV). At 4300 s(-1), continuous dynamic recrystallization (CDRX) occurred, followed by DRV inside the DRX grains with development of nanoscale subgrains.

• 出版日期2018-4-11
• 单位Saskatchewan; Saskatoon