A novel method to fabricate high aspect ratio microcoils

作者：Gu, Wen Jun; Sun, Shi; Dai, Xu Han; Ding, Gui Fu

来源：International Conference on Vehicle and Mechanical Engineering and Information Technology, VMEIT 2014, 2014-02-19 To 2014-02-20.

DOI：10.4028/www.scientific.net/AMM.543-547.600

• Coil
• High aspect ratio
• Microcoils
• SU-8
• TSV
• UV-LIGA technology

In this study, we developed a new method to fabricate microcoils with narrow and high aspect ratio coil lines using TSV and UV-LIGA technology in a SU-8 mold. The combination of SU-8 and TSV makes it possible to fabricate microstructures with high aspect ratio. TSV technology resolved the difficulties of electroplating with high aspect ratio. We designed and fabricated microcoils consisiting of coil lines with widths of 15μm and aspect ratio of 2.

• 出版日期2014
• 单位上海交通大学