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摘要
The reactions between Cu and the Sn2.5Ag0.8Cu solders doped with 0, 0.005. 0.01, 0.03, 0.06, or 0.1 wt.% Ni were studied. Reaction conditions included multiple reflows and solid-state aging at 160 degrees C. The Ni additions produced much thinner Cu3Sn layers for all the Ni concentrations used. Ni concentration higher than 0.01 wt.% could effectively retard the Cu3Sn growth even after 2000 h of aging, and accordingly 0.01 wt.% can be considered the minimum effective Ni addition.
- 出版日期2009-6-10
