A TSV-Based Bio-Signal Package With mu-Probe Array

作者：Chou Lei Chun^*; Lee Shih Wei; Huang Po Tsang; Chang Chih Wei; Chiang Cheng Hao; Wu Shang Lin; Chuang Ching Te; Chiou Jin Chern; Hwang Wei; Wu Chung Hsi; Chen Kuo Hua; Chiu Chi Tsung; Tong Ho Ming; Chen Kuan Neng

来源：IEEE Electron Device Letters, 2014, 35(2): 256-258.

DOI：10.1109/LED.2013.2293399

• TSV
• CMOS MEMS
• bio-signal probe

Bio-signal probes providing stable observation with high quality signals are crucial for understanding how the brain works and how the neural signal transmits. Due to the weak and noisy characteristics of bio-signals, the connected interconnect length between the sensor and CMOS has significant impact on the bio-signal quality. In addition, long interconnections with wire bonding technique introduce noises and lead to bulky packaged systems. This letter presents an implantable through-silicon via (TSV) technology to connect sensors and CMOS devices located on the opposite sides of the chip for brain neural sensing applications. With the elimination of traditional wire bonding and packaging technologies, the quality of bio-signal can be greatly improved.

• 出版日期2014-2
• 单位中国医科大学