A Novel Solution-Stamping Process for Preparation of a Highly Conductive Aluminum Thin Film

作者:Lee Hye Moon*; Choi Si Young; Kim Kyung Tae; Yun Jung Yeul; Jung Dae Soo; Park Seung Bin; Park Jongwook
来源:Advanced Materials, 2011, 23(46): 5524-+.
DOI:10.1002/adma.201102805

摘要

A novel solution-stamping process for the preparation of a highly conductive aluminum thin film on both rigid and flexible substrates is proposed. The superior electrical properties of Al thin films fabricated by the solution-stamping process compared to silver and gold films fabricated from colloidal nanoparticles are experimentally demonstrated, and their applications in electronic circuits on rigid and flexible substrates and to organic light-emitting diodes (OLEDs) are investigated.

  • 出版日期2011-12-8