A method for in situ measurement of residual layer thickness in nano-imprint lithography

作者：Hsu Wei Hsuan; Hong Hocheng^*; Shy Jow Tsong

来源：Microelectronic Engineering, 2013, 110: 132-140.

DOI：10.1016/j.mee.2013.03.007

• Nanoimprint lithography (NIL)
• Surface plasmon resonance (SPR)
• Residual layer
• Non-destructive measurement

Nanoimprint lithography has the advantages of high throughput, sub-10-nm fabrication process, and low cost. However, residual layer encountered in the imprinting process requires removal through reactive ion etching to maintain pattern fidelity. This study proposes a non-destructive method in situ to measure the thickness of residual layer, employing surface plasmon resonance in the imprinted feature during the imprinting stage. Variations in the thickness of the residual layer change the resonance patterns, including the reflectivity and resonance angle. Both experiment and simulation results demonstrate the effectiveness of this method in monitoring the thickness of residual layers.

• 出版日期2013-10
• 单位清华大学