Microstructure and residual stress of TiN films deposited at low temperature by arc ion plating

作者:Mei, Hai-juan; Zhao, Sheng-sheng*; Chen, Wei; Wang, Qi-min; Liang, Hai-feng
来源:Transactions of Nonferrous Metals Society of China, 2018, 28(7): 1368-1376.
DOI:10.1016/S1003-6326(18)64775-2

摘要

The TiN films were deposited on 316L stainless steel substrates at low temperature by arc ion plating. The influences of substrate bias voltage and temperature on microstructure, residual stress and mechanical properties of the films were investigated by EDS, SEM, XRD and nanoindenter tester, respectively. The results showed that the TiN films were highly oriented in (111) orientation with a face-centered cubic structure. With the increase of substrate bias voltage and temperature, the diffraction peak intensity increased sharply with simultaneous peak narrowing, and the small grain sizes increased from 6.2 to 13.8 nm. As the substrate temperature increased from 10 to 300 degrees C, the residual compressive stress decreased sharply from 10.2 to 7.7 GPa, which caused the hardness to decrease from 33.1 to 30.6 GPa, while the adhesion strength increased sharply from 9.6 to 21 N.