Anisotropy effects on the reliability of single-crystal silicon

作者：Borrero Lopez Oscar^*; Vodenitcharova Tania; Hoffman Mark

来源：Scripta Materialia, 2010, 63(10): 997-1000.

DOI：10.1016/j.scriptamat.2010.07.024

• Scratch test
• Fracture
• Elemental semiconductors
• Finite element analysis

Anisotropy effects on the reliability of single-crystal silicon were investigated by means of scratch tests along [1 1 0] and [1 0 0] crystallographic directions. It was found that fracture (partial cone cracks) starts along favoured {1 1 0) and {1 1 1} cleavage planes, with crack orientation varying upon the scratching direction. Moreover, the [1 0 0] direction was found to be twice as reliable as the [1 1 0] direction. Stress and phase analyses were carried out to explain this effect, which has implications for the design of silicon-based devices.

• 出版日期2010-11