Diffusional creep in Cu-Fe solid solutions

作者：Zhevnenko S^*

来源：Journal of Alloys and Compounds, 2014, 586: S210-S213.

DOI：10.1016/j.jallcom.2012.11.026

• Diffusion creep
• Copper based solid solution
• Viscosity
• Second phase formation

The activation energy of diffusional creep in copper-iron solid solutions was studied. Experiments were performed on foil samples in an atmosphere of dry hydrogen in a temperature range from about 1170-1340 K. The foils had a thickness of 1.8 x 10(-5) m and a length of about 0.15 m. The stress range was from 0 to 300 kPa. The method of the measurements was developed in our previous work and it was based on measuring the time dependence of stress on a sample.
The viscosity of the solid solutions was higher than that for pure copper. It was shown that there is a gap on temperature dependences of viscosity. The temperature of the gap was about 1295 K. Our previous experiments on the Cu-Co system showed the same feature in the activation energies.
As previously shown, two processes are required for describing the diffusional creep. They are the volume diffusion and generation/annihilation of the vacancies. The processes occur in sequence. We assume that only second type processes could lead to the appearance of the gap on the temperature dependence of viscosity in solid solutions.

• 出版日期2014-2-15