摘要

The integrated circuit (IC) stripline method (IEC 61967-8) has been recently introduced for measuring the radiated emission from ICs. This method requires an IC-stripline to have a voltage standing wave ratio (VSWR) lower than 1.25 in the frequency range of 150 kHz up to 3 GHz. When the method is applied to shielding measurement of on-board metallic cans enclosing ICs, which typically appear in most mobile devices, it is a great challenge to design an IC-stripline satisfying the VSWR requirement. In this paper, impedance and reflection characteristics of the IC-stripline on a test board with and without a metallic can are investigated by using an equivalent circuit model and three-dimensional full-wave simulation. To improve the VSWR performance of the normal IC-stripline above a metallic can, two novel IC-stripline structures are proposed to measure near-field radiated emissions from on-board metallic cans. By fabrication and experiment, it is verified that the proposed IC-striplines meet well the VSWR requirement of the IC-stripline method.

  • 出版日期2017-4