摘要
A technique for IC-compatible fabrication of a planar (in-plane) thermoelectric (TE) power generator using a thermopile composed of n-type bismuth telluride (Bi(2)Te(3)) and p-type antimony telluride (Sb(2)Te(3)) thin-films is presented. The research demonstrates that the thermal co-evaporation of bismuth/antimony (Bi/Sb) and telluride (Te) is the most suitable deposition technique. The measurements showed TE performance properties of the deposited thin-films that are comparable to those reported for the same materials in the bulk form. The measurements showed absolute values of the Seebeck coefficient in the range 91-248 mu V K(-1), an electrical resistivity in the 7.6-39.1 mu Omega m range and a thermal conduction between 1.3 and 1.8 W m(-1) K(-1). The best resulting figures-of-merit, ZT, at room temperatures were 0.97 and 0.56 (equivalent to power-factors, PF, of 4.87 x 10(-3) and 2.8 x 10(-3) W K(-1) m(-2)) for the Bi(2)Te(3) and Sb(2)Te(5) thin-films, respectively. The IC-compatibility and the dependence of the TE performance on technological details, such as photolithography and wet etching used for patterning the thin-films have also been investigated. The converter dimensions for best performance were analysed and a prototype of a planar TE power generator was fabricated.
- 出版日期2010-6