An Effective Thermal Model for FinFET Structure

作者：Cheng Ming Cheng^*; Smith Jeffrey A; Jia Wangkun; Coleman Ryan

来源：IEEE Transactions on Electron Devices, 2014, 61(1): 202-206.

DOI：10.1109/TED.2013.2291512

• FinFET
• thermal length
• thermal model/circuit

This brief presents a physics-based thermal model for FinFET structure that is constructed mainly based on the concept of characteristic thermal lengths representing various heat loss paths for heat conduction along each segment of the fins, channel, and metal/poly wires. The model is calibrated by extracting the thermal resistances and thermal lengths describing the heat conduction and losses in each segment and extended to multifin structure to account for thermal coupling between fins. The accuracy of the model is demonstrated against 3-D numerical simulations.

• 出版日期2014-1