科研之友
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摘要
The plane problem for bonded functionally graded piezoelectric materials containing a crack perpendicular to the interface is considered when the material properties along x-axis vary in exponential form. The Fourier transform technique and dislocation density functions are used to formulate the problem in terms of a system of singular integral equations and obtained asymptotic analytical solution of crack-tip stress field. Numerical calculations are carried out, and the effects of crack geometric parameters on the stress intensity factor and the energy release rate are shown graphically.
