摘要
In this paper, a mechanic model is developed for the stiffness and stress of a 3D micro tactile sensor for 3D dimensional metrology of micro structure, which is validated by the finite element analysis (FEA). The design parameters of the sensor have been investigated using ANSYS. Some experiments by integrating the sensor with a 3D dimensional metrological positioning platform are performed to validate the design, which shows 5 nm and 10 nm resolution in z and x/y direction respectively, working range of 4.7 mu m and cross talk of 0.5%.
- 出版日期2014-2
- 单位同济大学; 上海市计量测试技术研究院; 中国科学院理化技术研究所