Bonding of Bi2Te3-Based Thermoelectric Legs to Metallic Contacts Using Bi0.82Sb0.18 Alloy

作者：Vizel Roi; Bargig Tal; Beeri Ofer^*; Gelbstein Yaniv^*

来源：Journal of Electronic Materials, 2016, 45(3): 1296-1300.

DOI：10.1007/s11664-015-4003-2

• Thermoelectrics
• Bi2Te3
• bonding
• Bi-Sb

Thermoelectrics is gaining increased attention as a renewable direct energy conversion method from heat to electricity. The most efficient and up-to-date thermoelectric materials for temperatures of up to 250 degrees C are (Bi1-xSbx)(2) (Te1-ySey)(3) alloys. In the current research, to discover practical thermoelectric power generation devices capable of operation at such temperatures, Bi0.82Sb0.18 alloy was considered as a lead-free high-temperature (< 250 degrees C) solder composition for bonding of n-type Bi2Te2.4Se0.6 and p-type Bi0.4Sb1.6Te3 legs into Cu, Ag, Ni and Fe metallic bridges. In the case of Cu, fine contacts with low electrical contact resistance of similar to 1.5 +/- 0.5 m Omega mm(2) were observed upon soldering at 350 degrees C.

• 出版日期2016-3