A study on the mechanical properties and deformation behavior of injection molded PMMA-TSP laminated composite

作者：Wang Jaeyoon; Lee Moon Kyu; Park Seon Mi; Hong Seokmoo; Kim Naksoo^*

来源：Korea-Australia Rheology Journal, 2012, 24(1): 23-33.

DOI：10.1007/s13367-012-0003-4

• PMMA-TSP laminated module
• high temperature conditions
• temperature-dependent deformation
• visco-elastic-plastic analysis
• creep behavior

To evaluate the deformed features of a polymer and touch screen panel laminated material and to secure a reliability of the design method, it is crucial to predict a thermo-mechanical behavior of the polymers. The reliability problems of polymer-TSP laminated module subjected to temperature and humidity changes mainly occur due to features with time-dependent material properties as well as differences in the coefficients of thermal expansion between the polymer and TSP. Therefore, it is necessary to consider the viscous behavior which causes changes in material properties which include temperature-dependent properties along with the time-dependent properties. In this study, a tensile test is conducted to obtain fundamental material properties and a creep test is used to characterize viscous properties of the polymer. Material properties from the tensile and the creep test are verified by the tensile and creep simulations. Also, the finite element analysis is used to simulate the time-dependent behaviors during a high temperature conditions while predicting thermal deformations. Numerical results are compared with experimental results. The result shows that the shape deformations of the polymer-TSP laminated module calculated by the finite element analysis with visco-elastic-plastic material model are in a good agreement with the experiment. Based on analytical results, we predict the thermal deformation of the PMMA-TSP composite plate in consideration of the effect of viscous features and set up the organized numerical analysis procedure using FE analysis.

• 出版日期2012-3