A Geometry-Independent Lifetime Modelling Method for Aluminum Heavy Wire Bond Joints

作者:Grams Arian*; Hoefer Jan; Middendorf Andreas; Schmitz Stefan; Wittler Olaf; Lang Klaus Dieter
来源:16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems (EuroSimE), 2015-04-19 to 2015-04-22.

摘要

Wire bond degradation is a limiting factor for the lifetime of state of the art power modules. So, there is a need for widely applicable and proven modelling techniques to achieve a reliable design.
In this paper, a new crack growth law has been developed and calibrated with experimental data. By defining a failure criterion and optimizing model parameters, good lifetime predictions have been achieved. In addition, further possibilities to use this modelling approach have been proposed, e.g. damage in interconnect layers as sinter silver or solder layers could be considered.

  • 出版日期2015