A 3D Photonic-Electronic Integrated Transponder Aggregator With 48 x 16 Heater Control Cells

作者：Zecevic Nikola; Hofbauer Michael; Goll Bernhard; Zimmermann Horst; Tondini Stefano; Chalyan Astghik; Fontana Giorgio; Pavesi Lorenzo; Testa Francesco; Stracca Stefano; Bianchi Alberto; Manganelli Costanza; Velha Philippe; Pintus Paolo; Oton Claudio; Kopp Christophe; Adelmini Laetitia; Lemonnier Olivier; Pares Gabriel; Chiaretti Guido; Serrano Aina; Ayucar Jose Angel; Preve Giovani Battista; Kim Min Su; Lee Jong Moo

来源：IEEE Photonics Technology Letters, 2018, 30(8): 681-684.

DOI：10.1109/LPT.2018.2811464

• Optical switches
• micro-ring resonator
• thermal tuning
• 3D integration
• electronic-photonic integration
• low power consumption
• heater control

An electronic integrated circuit (EIC) and a silicon photonic integrated circuit (PIC) are 3D-integrated. The EIC using the complementary metal-oxide-semiconductor (CMOS) part of STMicroelectronics' BCD8sp 0.16 mu m technology controls all 768 switches in the PIC individually and monitors them with 84 transimpedance amplifiers. A scalable analog-digital approach with a cell size of 100 x 100 mu m(2) for thermal control of optical ring resonator switch matrices is introduced. An electrical power consumption of 220 mW for all electronic control circuits of the optical switch matrix is resulting in 5.5% of the power needed by a constant-voltage control approach.

• 出版日期2018-4-15