摘要

Using an exact solution for an elliptical hole in a perfectly plastic material, an expression is derived for the resistance of a ductile material undergoing subcritical crack propagation in the plane. This resistance curve is based on an analogy to the J-integral where an energy dissipation rate is determined rather than an energy release rate. The Tresca yield condition under plane stress loading conditions is employed in this derivation as well as finite deformation theory. This resistance curve is applicable to the initial stage of subcritical crack growth for a ductile material subject to crack tip blunting.

  • 出版日期2018-3

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