Nanoscale deformation analysis of a crack-tip in silicon by geometric phase analysis and numerical moire method

作者：Zhao, C. W.; Xing, Y. M.^*

来源：Optics and Lasers in Engineering, 2010, 48(11): 1104-1107.

DOI：10.1016/j.optlaseng.2009.12.010

• Crack-tip
• Strain
• Geometric phase analysis
• Numerical moire method
• High-resolution transmission electron microscopy

A micro-crack in a single-crystal silicon was investigated using a high-resolution transmission electron microscopy. In particular, geometric phase analysis and numerical moire method were employed to analyze the deformation fields of this crack-tip. The strain field maps of the crack-tip Indeed show that the deformation can only occur at the crack-tip area The maxima of the strain components, namely, epsilon(xx), epsilon(yy), and epsilon(xy) at the crack-tip area can reach 1.47%, 2.91%, and 2.47%, respectively.

• 出版日期2010-11
• 单位内蒙古工业大学