Micromachined membrane structures for pressure sensors based on AlGaN/GaN circular HEMT sensing device

作者：Lalinsky T; Hudek P; Vanko G^*; Dzuba J; Kutis V; Srnanek R; Choleva P; Vallo M; Drzik M; Matay L; Kostic I

来源：Microelectronic Engineering, 2012, 98: 578-581.

DOI：10.1016/j.mee.2012.06.014

• Circular HEMT
• AlGaN/GaN
• Si dry etching
• Microraman spectroscopy
• ANSYS

A new design concept of pressure sensors based on circular high electron mobility transistor (C-HEMT) sensing devices integrated on circular, ring and/or sequential ring AlGaN/GaN membrane structures is introduced for the first time. The micromachining process technology of 1.9 mu m thick AlGaN/GaN membrane structures patterned on Silicon substrate is experimentally verified. The mechanical properties of the membranes are investigated by two different experimental methods and simulation. They reveal the membrane tensile residual stress of the value about 280-300 MPa. A non-linear behavior of maximal deflection with the applied pressure is predicted by the ANSYS simulation. The maximal membrane deflection about 2.75 mu m is estimated for the applied pressure of 1 MPa. The functionality of the integrated membrane-based C-HEMT sensing device is successfully verified to be applied for pressure sensing.

• 出版日期2012-10
• 单位中国科学院电工研究所