Mechanical properties and intermetallic compound formation at the Sn/Ni and Sn-0.7wt.%Cu/Ni joints

作者：Chen SW^*; Lee SW; Yip MC

来源：Journal of Electronic Materials, 2003, 32(11): 1284-1289.

DOI：10.1007/s11664-003-0024-3

• Ni/Sn/Ni
• Sn-Cu solder
• interfacial reactions
• mechanical properties

The Ni/Sn/Ni and Ni/Sn-0.7wt.%Cu/Ni couples are reacted at 200degreesC for various lengths of time. The tensile strengths of these annealed specimens are determined at room temperature. In addition, the interfacial reactions and fracture surfaces of the specimens are examined as well. These properties are important for the evaluation of the usage of Sn-0.7wt.%Cu lead-free solders, which has been not available in the literature. Only the Ni3Sn4 phase is formed at the Sn/Ni interface, but both the Cu6Sn5 and Ni3Sn4 phases are formed at the Sn-0.7wt.%Cu/Ni interface. The thickness of the intermetallic compound layers grows, while the joint strength decreases with longer reaction time. With a 1-h reaction at 200degreesC, the fracture surface is in the solder matrix for both of the two kinds of couples. Shifting toward the compound layer with longer reaction time, the fracture surface is in the Ni3Sn4 layer in the Sn/Ni couple and is at the interface between the Cu6Sn5 and Ni3Sn4 in the Sn-0.7wt.%Cu/Ni after reacting at 200degreesC for 240 h.

• 出版日期2003-11
• 单位清华大学