Numerical Simulation and Research on the Interface Structure of Wide Cu/Al Composite Plate Prepared by Solid-Liquid Composite Method

作者：Chang, Qing-Hua; Xie, Jing-Pei^*; Tian, Han-Wei; Wang, Ai-Qin; Wang, Wen-Yan; Huang, Ya-Bo

来源：Science of Advanced Materials, 2018, 10(7): 1010-1017.

DOI：10.1166/sam.2018.3295

• Solid-Liquid Composite Method
• Cu/Al Composite Plate
• Bonding Mechanism
• Interface

Solid-liquid composite model of Cu/Al composite plate was set up by Fluent software to study the influence of Solid-liquid composite method (feeding speed and casting temperature of liquid Al) on the Kiss point position, the temperature field, flow field and the liquid holdup distribution of Al. The wide Cu/Al composite plate were prepared using Solid-liquid composite method. The interface bonding mechanism of Cu/Al composite plate was analyzed using TEM analysis. Results show that the metallurgical bonding effect is better when the Cu strip is without preheating, the feeding speed is 1 m/min, and the pouring temperature is 993 K. Additionally, the thickness of the interface in Cu/Al composite plate prepared by Solid-liquid composite method is about 0.3 mu m, and only one kind of intermetallic compounds CuAl2 with tetragonal phase structure is generated.

• 出版日期2018-7
• 单位河南大学