A metastable phase of tin in 3D integrated circuit solder microbumps

作者:Liu Yingxia; Tamura Nobumichi; Kim Doug Wook; Gu Sam; Tu K N*
来源:Scripta Materialia, 2015, 102: 39-42.
DOI:10.1016/j.scriptamat.2015.02.009

摘要

A metastable phase of Sn has been found to co-exist with beta-Sn in Pb-free SnAg microbumps in 3D integrated circuit technology. Synchrotron microbeam X-ray diffraction, high-resolution TEM imaging and selected-area electron diffraction were used to confirm the metastable phase, which has an orthorhombic lattice, with lattice parameter a = 0.635 nm, b = 0.639 nm, and c = 1.147 nm. Its composition is Sn containing a few percent of Ni. A higher rate of nucleation might have enabled its formation.

  • 出版日期2015-6