科研之友
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摘要
Features of transient liquid phase (TLP) bondability of high-volume fraction (70 vol.%) SiC particle-reinforced A356 composite for popular Cu interlayer were investigated. Although Cu foil was melted, molten Cu was completely expulsed, indicating that the numerous SiC particles significantly deteriorated wettability not only at particle/braze metal (P/M) interface, but also at the matrix/braze metal (M/M) interface. For the reason of poor wettability at P/M interface, a model showing there is a "window period" for actual wetting reaction (allowing liquid phase to be in contact with surficial SiC particles) much shorter than nominal isothermal solidification time during TLP bonding of the composite containing sintered ceramic preform was proposed. For the poor wettability at M/M interface, both size effect of too small matrix unit (2 20 mu m) and restraint effect of the rigid porous ceramic preform on suppressing oxide film crack on the small matrix unit surface were proposed. Thus, chemical route to disrupt oxide film on the small matrix unit surface should be preferred in braze composition design. For example, Al-27Cu-5Si-2Mg-1Ti braze was developed by co-addition of Mg and Ti to improve wettability and to in situ reinforce bond seam, respectively; Ti also could remedy Mg loss for improving wettability.
