A Modular Test-Suite for the Validation and Verification of Electromagnetic Solvers in Electromagnetic Compatibility Applications

作者:Flintoft Ian D*; Dawson John F; Dawson Linda; Marvin Andrew C; Alvarez Jesus; Garcia Salvador G
来源:IEEE Transactions on Electromagnetic Compatibility, 2017, 59(1): 111-118.
DOI:10.1109/TEMC.2016.2599004

摘要

Computational solvers are increasingly used to solve complex electromagnetic compatibility (EMC) problems in research, product design, andmanufacturing. The reliability of these simulation tools must be demonstrated in order to give confidence in their results. Standards prescribe a range of techniques for the validation, verification, and calibration of computational electromagnetics solvers including external references based on measurement or for cross-validation with other models. We have developed a modular test-suite based on an enclosure to provide the EMC community with a complex external reference for model validation. We show how the test-suite can be used to validate a range of electromagnetic solvers. The emphasis of the test-suite is on the features of interest for EMC applications, such as apertures and coupling to cables. We have fabricated a hardware implementation of many of the test-cases and measured them in an anechoic chamber over the frequency range to 1-6 GHz to provide a measurement reference for validation over this range. The test-suite has already been used extensively in two major aeronautical research programs and is openly available for use and future development by the community.

  • 出版日期2017-2