Analyses and statistics of the electrical fail for flip chip packaging by using ANSYS simulation software and really underfill materials

作者：Tsai, Shang-Te; Lin, Chi-Yu; Wu, Sung-Mao; Chang, Chung-Yao; Yang, Cheng-Fu^*

来源：Microsystem Technologies, 2018, 24(10): 4017-4024.

DOI：10.1007/s00542-017-3605-4

• DRIVEN
• FLOW

ANSYS simulation software has gold standard for modeling and simulating surface chemistry reactions that are used for the conceptual development of combustion systems in chemical and materials processing equipment. In this study, three different models of the solder bumps were arranged, designed, and simulated by ANSYS simulation software. The first model was a single solder bump, which had the height of 70 mu m and diameter of 115 mu m, and the both diameters to contact upper chip and lower substrates were 90 mu m. The second model was that the single solder bumps were arranged to form an array with different spacing between two "single solder bumps'', the area and height were 1520 mu m x 3610 mu m and 70 mu m. The third model was that the single solder bumps with two different arranged arrays were formed on the substrates on different sides, the distances between two "single solder bumps'' had different values in the two arranged arrays, and the area and height for this model were 2600 mu m x 2570 mu m and 70 mu m. We would use five differently underfill materials with different properties (including viscosity) as the simulated parameters in the third model. Finally, the five underfill materials were used in the dispensing experiment to find the optimum one for the flip chip packaging.

• 出版日期2018-10
• 单位宁德师范学院; 中国人民解放军空军电子技术研究所