Unveiling the electromigration physics of ULSI interconnects through statistics

作者:Tan Cher Ming*; Raghavan Nagarajan
来源:Semiconductor Science and Technology, 2007, 22(8): 941-946.
DOI:10.1088/0268-1242/22/8/020

摘要

Electromigration is an important failure phenomenon in ULSI. There are several underlying physical mechanisms in an electromigration process depending on the stress conditions. In this work, we use various statistical techniques to investigate the number of such mechanisms for a given set of electromigration data. The statistical distribution of each mechanism can be found and the failure units that belong to the different statistical distributions can be identified. Through this methodology, the existence of the incubation phenomena for aluminum electromigration is shown, and the time for the incubation is found to be different for different underlying mechanisms.

  • 出版日期2007-8
  • 单位南阳理工学院