科研之友
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摘要
Characterization of solder alloys is of primary importance for manufacturers due to the wide use of these alloys as interconnects for electronic packaging. Numerous investigations have so far been dedicated to determination of their mechanical properties like their creep response under thermomechanical loading, in particular. There is a broad variety of experimental devices and techniques that the researchers employed to study the different types of solders. We have recently designed a micro-tensile tester to characterize miniature solder specimens under various conditions of temperature and extension rate. In the present work, this experimental apparatus is complemented with imaging equipment, giving the ability to perform Digital Image Correlation (DIC) for full-field measurements on solder materials. The suitability and accuracy of both the optical system and the DIC technique for tin-based alloys characterization are first evaluated, based on specific assessment criteria. It is found that the system resolution is sufficient to obtain reliable results. A full-field strain measurement is then done by testing a standard specimen. Materials parameters, such as the elastic constants, are extracted from DIC data and compared with the measures obtained from the conventional sensors equipping the microtester, showing the ability of the newly designed optical system to be used in the small strain range. The study of necking has also been proven to be accurate with this system, allowing the precise evaluation of the highly localized strain in the specimen.
- 出版日期2017-6
