A Novel, Organic, UV-Sensitive Resist Ideal for Nanoimprint-, Photo- and Laser Lithography in an Air Atmosphere

作者：Greer Andrew I M^*; Gadegaard Nikolaj

来源：Electronic Materials Letters, 2015, 11(4): 544-551.

DOI：10.1007/s13391-015-4401-x

• step-and-repeat
• etch
• resist
• oxygen
• photolithography
• metallization

A UV-sensitive resist capable of curing in an oxygen atmosphere using single wavelength LED light sources is a niche area many UV-nanoimprint lithography resists are incapable of addressing. However, the novel negative tone resist, presently (2015) known as DELO-KATIOBOND OM VE 110707 (Delo-Katiobond), from Delo Industrial 10, Adhesives has been designed to be specifically compatible with such conditions within the 320 - 440 nm wavelength range. The authors acquired some of the resist and evaluated its photolithographic performance under such conditions. Several lithographic methods were evaluated, namely nanoimprint-, photo- and laser lithography. Under the step-and-flash nanoimprint test conditions the Delo-Katiobond outperformed commercial alternatives from AMO and Microresist Technology. Processing and development conditions for photo- and laser lithography are also presented. Different discrete wavelengths were used for curing the resist in these two separate lithography processes, 365 nm and 405 nm respectively. The laser-defined lines in Delo-Katiobond coatings were found to be a fraction of alternative resist Nano SU-8 from MicroChem. The functionality of the Delo-Katiobond resist is also evaluated here. It is demonstrated to be effective for a range of resist functions including metal lift-off, elastomeric polymer casting and as a mask for reactive ion etching of a variety of materials.

• 出版日期2015-7