科研之友
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摘要
The microstructure and shear strength of active-transient liquid phase (A-TLP) bonded joints of high volume fraction (70 vol%) SiC particle reinforced A356 composite using an active interlayer of quaternary Al-33Cu-6Mg-1Ti (mass%) were compared with TLP bonded joints using Ti-free Al-33Cu-6Mg interlayer to establish suitable interlayer composition design route. For the developed Ti-containing active filler metal, void free dense interface between SiC particle and bond seam with C-Al-Si(-Mg) or C-Al-Si-Ti product was readily obtained, and the joint shear strength increased with increasing joining temperature from 550 degrees C to 580 degrees C and 600 degrees C. While for the Ti-free interlayer, gaps between most SiC and metallic bond seam and between some matrix/bond interfaces remained, even at 600 degrees C. The maximum shear strength of the joints using Al-33Cu-6Mg-1Ti and Al-33Cu-6Mg were 62 MiPa (with small fracture unit and partial fracture path within A356 matrix) at 600 degrees C and 31 MPa (with too large fracture unit and initial interface fracture path) at 580 degrees C, respectively. Thus, the beneficial effects of Ti addition into interlayer on improving (i) wettability between SiC particle and metallic bond seam and (ii) joint shear strength were demonstrated.
- 出版日期2015-2
- 单位西安交通大学
