Ductility of metal thin films in flexible electronics

作者:Niu RongMei; Liu Gang; Ding XiangDong; Sun Jun*
来源:Science China Technological Sciences, 2008, 51(11): 1971-1979.
DOI:10.1007/s11431-008-0118-5

摘要

Flexible, large area electronics using various organic and inorganic materials are beginning to show great promise. During manufacture and service, large deformation of these hybrid materials will pose significant challenges in terms of high performance and reliability. A deep understanding of the ductility or flexibility of macroelectronics becomes one of the major issues that must be addressed urgently. This paper describes the current level of understanding on the thin-film ductility, both free-standing and substrate-supported, and relevant influencing factors.