摘要

In this brief, amorphous indium-gallium-zinc oxide (a-IGZO) thin-film transistors (TFTs) are fabricated at < 150 degrees C. Inductively coupled plasma chemical vapor deposition (ICP-CVD) is used to grow SiOx gate dielectric of the a-IGZO TFTs. The fabricated devices exhibit a high saturation mobility of 26.85 cm(2)/V.s, a steep subthreshold swing of 0.145 V/decade, and an ON/OFF current ratio of 2.3 x 10(7). Atomic force microscope and scanning electron microscope images show that the surface characteristics of the ICP-CVD SiOx gate dielectric are much superior to those of the conventional plasma-enhanced CVD SiOx. It is suggested that the superior surface characteristics of the ICP-CVD SiOx are the main origin of the high performance of the a-IGZO TFTs with the ICP-CVD SiOx gate dielectric.