Novel Silicon-Based LED Packaging Module With an Integrated Photosensing Element

作者：Tseng Kuochun^*; Tsou Chingfu

来源：IEEE Photonics Technology Letters, 2013, 25(5): 515-518.

DOI：10.1109/LPT.2013.2244207

• LED packaging
• photosensor
• sensitivity
• silicon

This letter presents a novel design for a silicon-based light emitting diodes (LEDs) packaging module with an integrated photosensor. The carrier substrate for the LED submount and a photosensitive element are directly fabricated on a silicon wafer, using ion doping and inductively coupled plasma etching, thereby achieving a smart LED packaging module featuring miniaturization, integration and low cost. The subsequent assembly, with a specific heat sink and a shelled optical cap, results in a decrease in thermal effects and improves measurement sensitivity. The typical experiment result shows that the operating temperatures of the LED die and the photosensing element remain below 70 degrees C and 45 degrees C, respectively, when the input current to the LED is 0.3 A. The sensitivity of the photosensing module is 8.2 mu A/nt for a chip size of 1 x 1 x 0.15 cm(3). The working temperature and photosensitivity of this packaging module can be improved by using a system with high heat dissipation efficiency.

• 出版日期2013-3-1