科研之友
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摘要
The degree to which liquid phenol formaldehyde resin for flakeboard applications can be replaced by soy flour was studied through a design of experiment approach. Up to ten percent substitution could be achieved while substantially maintaining board properties. Higher levels of substitution increased the viscosity of the resin droplet, which reduced resin spread and various strength properties. The loss of strength was most apparent for dense boards where the spreading limitation reduced the relative bonded area.
- 出版日期2017-1
