科研之友
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摘要
Two-dimensional (2-D) data maps are generated in certain advanced manufacturing processes. Such maps contain rich information about process variation and product quality status. As a proven effective quality control technique, statistical process control (SPC) has been widely used in different processes for shift detection and assignable cause identification. However, charting algorithms for 2-D data maps are still vacant. This paper proposes a variable selection-based SPC method for monitoring 2-D wafer surface. The fused LASSO algorithm is firstly employed to identify potentially shifted sites on the surface; a charting statistic is then developed to detect statistically significant shifts. As the variable selection algorithm can nicely preserve shift patterns in spatial clusters, the newly proposed chart is proved to be both effective in detecting shifts and capable of providing diagnostic information for process improvement. Extensive Monte Carlo simulations and a real example have been used to demonstrate the effectiveness and usage of the proposed method.
