Mechanics of shaft-loaded blister test for thin film suspended on compliant substrate

作者：Zhao MingHao^*; Zheng WeiLing; Fan CuiYing

来源：International Journal of Solids and Structures, 2010, 47(18-19): 2525-2532.

DOI：10.1016/j.ijsolstr.2010.05.011

• Shaft-loaded blister test
• Thin film
• Compliant substrate
• Residual stress
• Deflection
• Analytical solution
• Numerical solution

Based on the von Karman plate theory, the mechanics of a shaft-loaded blister test for thin film/substrate systems is studied by considering elastic substrate deformations and residual stresses in these films. In testing, films are attached to a substrate provided with a circular hole, through which loading is applied to the film by a flat-ended shaft of circular cross-section. The effect of substrate deformation on the deflection of the loaded film is taken into account by using a line spring model. For small deflections, an analytical solution is derived, while for large deflections a numerical solution is obtained using the shooting method. The resulting load-shaft displacement relation, which is essential in blister tests, compares favorably with finite element analysis.

• 出版日期2010-9
• 单位郑州大学