Numerical simulation on thixoforging of electronic packaging shell with SiCp/A356 composites

作者：Wang Kai-kun^*; Wang Fu-yu; Chen Xue-jun; Wang Lu; Ma Chun-mei

来源：Transactions of Nonferrous Metals Society of China, 2010, 20(9): 1707-1711.

DOI：10.1016/S1003-6326(09)60362-9

• thixo-forming
• SiCp/A356 composites
• electronic packaging shell
• numerical simulation

Based on the research of modern electronic packaging materials, thixo-forming technology was used to fabricate electronic packaging shell. The process of thixo-extrusion with SiCp/A356 composites was simulated by the finite element software DEFORM-3D, then the flow velocity field, equivalent strain field and temperature field were analyzed. The electronic packaging shell was manufactured by extrusion according to the results from numerical simulation. The results show that thixo-forming technology can be used in producing electronic package shell with SiCp/A356 composites, and high volume fraction of SiCp with homogeneous distribution can be achieved, being in agreement with the requirements of electronic packaging materials.

• 出版日期2010-9
• 单位北京科技大学; 中国电子科技集团公司第三十八研究所