Processor Tile Shapes and Interconnect Topologies for Dense On-Chip Networks

作者：Xiao Zhibin^*; Baas Bevan M

来源：IEEE Transactions on Very Large Scale Integration (VLSI) Systems, 2014, 22(6): 1377-1390.

DOI：10.1109/TVLSI.2013.2265937

• CMOS digital integrated circuits
• digital signal processing (DSP)
• hexagonal processor
• interconnection topology
• many-core processor
• multimedia
• network on chip (NoC)

We propose two eight-neighbor, two five-nearest-neighbor, and three six-nearest-neighbor interconnection topologies for many-core processor arrays-three of which use five-sided or hexagonal processor tiles-which typically reduce application communication distance and result in an overall application processor that requires fewer cores and lower power consumption. A 16-bit processor with the appropriate number of input and output ports is implemented in all topologies and tile shapes. The hexagonal and five-sided processor tiles and arrays of tiles are laid out with industry standard automatic place and route design flow and Manhattan-style wires without full-custom layout. A 1080p H. 264/AVC residual video encoder and a 54 Mb/s 802.11a/g OFDM wireless local area network baseband receiver are mapped onto all topologies. The six-neighbor hexagonal tile incurs a 2.9% area increase per tile compared with the four-neighbor 2-D mesh, but its much more effective interprocessor interconnect yields an average total application area reduction of 22% and an average application power savings of 17%.

• 出版日期2014-6