Additive manufacturing of 3D substrate integrated waveguide components

作者：Moscato S; Bahr R; Le T; Pasian M; Bozzi M^*; Perregrini L; Tentzeris M M

来源：Electronics Letters, 2015, 51(18): 1426-1428.

DOI：10.1049/el.2015.2298

• three-dimensional printing
• substrate integrated waveguides
• microstrip lines
• 3D substrate integrated waveguide components
• 3D SIW components
• additive manufacturing technique
• 3D printing process
• t-glase filament
• microwave components
• 3D printed material
• microstrip lines technique
• SIW cavity resonator
• E-plane bends

The implementation of fully three-dimensional (3D) substrate integrated waveguide (SIW) components by using an additive manufacturing technique is demonstrated for the first time. In particular, a 3D printing process based on the t-glase filament has been adopted. 3D printing allows for the manufacturing of very complex shapes in a few hours, thus leading to a one-day prototyping time for microwave components. To characterise the electromagnetic properties of the 3D printed material, a microstrip lines technique has been adopted. To fully demonstrate the potential of the proposed fabrication process, a SIW cavity resonator and a 3D SIW interconnect with four E-plane bends have been fabricated and tested.

• 出版日期2015-9-3