A coupled electromechanical analysis of a piezoelectric layer bonded to an elastic substrate: Part II, numerical solution and applications

作者：Zhang BN; Zhang JQ^*; Fan JH

来源：International Journal of Solids and Structures, 2003, 40(24): 6799-6812.

DOI：10.1016/S0020-7683(03)00312-3

This two-part contribution presents a novel and efficient method to analyze the two-dimensional (2-D) electromechanical fields of a piezoelectric layer bonded to an elastic substrate, which takes into account the fully coupled electric and mechanical behaviors. In Part I, we have obtained a system of governing integro-differential equations for the structure via a variational principle. This part presents a numerical solution algorithm of the integro-differential equations and the numerical results of some applications. A numerical algorithm for solving the system of four integro-differential equations with strongly singular kernels is developed. The convergence of the numerical algorithm is discussed. The numerical results suggest that the fully coupled electromechanical analysis is helpful for a better understanding of the performance of the piezoelectric sensor and actuator. The interfacial normal stress is much higher than the interfacial shear stress, suggesting that the interfacial normal stress causes a delamination initiation.

• 出版日期2003-12
• 单位重庆大学; 上海大学