科研之友
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摘要
Based on previous results of bond strength, scanning electron microscopy(SEM)/energy dispersive spectroscopy (EDS) and x-ray photoelectron spectroscopy (for thin film thickness in the range of 50 to 200 nm range), it is expected for a moderate film thickness of titanium (over 50 nm) for the system of sputtered Ti-coated glass/polymer two factors play important roles in getting strong bond between Ti/Polyimide interface: (i) mechanical interlocking property and (ii) chemical bond formation such as Ti-C, Ti-O between Ti and imidex (PI) film. In this study, a systematic investigation has been conducted to understand the effects of thin films on bond quality and on failure mechanism of the interface between 400 nm sputtered Ti-coated glass/imidex (PI) system. This article basically studies if for this higher film thickness the failure pattern and bond strength are consistent with the previous data. From previous studies (for thin film thickness of 50 to 200 nm) the conclusion extracted is thin film with thickness of less than 50 nm exhibited low bond strength when compared to film thickness over 50 nm and from the results obtained in this study it is concluded that the bond reliability and failure modes of sputtered Ti film on glass are consistent even for a film thickness as high as 400 nm and three types of failure modes are found : (i) cohesive failure mode, (ii) Ti/glass interface failure mode, and (iii) glass failure mode. The roughness value for this coating thickness is 17 nm.
- 出版日期2012-2
