摘要

The authors demonstrate a subtractive stamping technique for patterning metal electrodes of organic light emitting devices. Patterning is achieved by placing a relief patterned polydimethylsiloxane stamp in contact with a planar metal electrode film and subsequently peeling off the stamp. A fast peel rate increases the weak adhesion energy of the stamp to the metal so that no surface treatment, pressure, or temperature control is necessary to lift-off the metal film in contact with the stamp. Patterning is dependent on metal film thickness, geometry of the features, and peel direction of stamp release. The minimum feature size patterned is 13 mu m wide stripes within < 1 mu m in-plane edge roughness and 0.1 mu m height transition region of the patterned edge.

  • 出版日期2007-7-23