Fabrication of insulated metal substrates with organic ceramic composite films for high thermal conductivity

作者：Kim Seonghyeop^*; Kim Jooyoung; Kim Jin Hyeok^*

来源：Ceramics International, 2017, 43(11): 8294-8299.

DOI：10.1016/j.ceramint.2017.03.163

• Insulated metal substrate
• Organic ceramic composite
• Coating mixture
• Sol-gel
• Thermal conductivity
• Breakdown voltage

Insulated metal substrates (IMSs) were fabricated and characterized using an organic ceramic composite as a coating mixture. Organic-inorganic sol solutions were prepared by a sol-gel process using TEOS (tetraethylorthosilicate), MTMS (methyltrimethoxysilane) and PhTMS (phenyltrimethoxysilane). Ceramic fillers were composed of aluminum oxide (1 and 4 pm) and silicon nitride. The optimal ratio of ceramic filler in the coating mixture was found to be 70 wt%. A thermal conductivity of 3.16 W/mK and a breakdown voltage of 4 kV with a leakage current of 0.17 mA/cm(2) were obtained for the 122 mu m-thick film. A well-networked microstructure between the sol resin and filler in the organic ceramic composite films enhanced the properties of the IMS, such as thermal conductivity and electric insulation.

• 出版日期2017-8-1