Novel Addressable Test Structure for Detecting Soft Failure of Resistive Elements When Developing Manufacturing Procedures

作者：Sato Shingo^*; Omura Yasuhisa

来源：IEEE Transactions on Semiconductor Manufacturing, 2018, 31(1): 124-129.

DOI：10.1109/TSM.2017.2779809

• Addressable test structure
• failure
• soft open and short
• variation
• yield

A novel addressable test structure for detecting soft failures of resistive elements is proposed. Its architecture is much simpler than that of previous works, but all functions needed to analyze the electrical properties of detected failures, for example, the aging test with overcurrent, can be realized within the architecture. This makes it more powerful than previous designs. Since the addressable test structure proposed here also has a smaller footprint, it can realize cost effective evaluations.

• 出版日期2018-2