Facile synthesis and electrical performance of silica-coated copper powder for copper electronic pastes on low temperature co-fired ceramic

作者：Dong, Qing; Huang, Chao; Duan, Guojie; Zhang, Fang; Yang, De'an^*

来源：Materials Letters, 2017, 186: 263-266.

DOI：10.1016/j.matlet.2016.09.116

• Silica-coating
• Copper paste
• Microstructure
• Thick films

Silica-coated copper powders with different silica content were prepared by sol-gel process. The pastes with the silica-coated copper powders were prepared and screen-printed on low temperature co-fired ceramic substrate (LTCCs) to form copper films. The films were sintered at 910 degrees C for 1 h under N-2 atmosphere. The morphology of silica-coated copper powder, copper film surface and cross-section were observed. The sheet resistance was also measured. The copper film with 2 wt% silica-coating on LTCCs was well dense and displayed good bonding behavior. The film had a thickness of approximate 8 mu m and a sheet resistance of 6 m Omega/square.

• 出版日期2017-1-1
• 单位天津大学