An Analytic Method for Capacitance Extraction of Asymmetric Vias

作者:Zhu Guangran*; Thiel Werner; Bracken J Eric
来源:IEEE Microwave and Wireless Components Letters, 2015, 25(5): 280-282.
DOI:10.1109/LMWC.2015.2409795

摘要

This paper considers the problem of via-plane capacitance extraction for power and signal integrity analysis of printed circuit boards and electronic packages. The recently proposed full-wave method is extended to handle asymmetric antipads by judiciously selecting the integration domain of the magnetic field in the parallel-plate cavity. Numerical results demonstrate its agreement with the capacitance obtained from the quasi-static method.

  • 出版日期2015-5

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