摘要

To expand the measurement range of the method introduced in part 1 of this paper series, a pyramid array artifact is proposed and calibrated on a CMM. In the calibration procedure, the distance between the pyramids is presented by data from three groups. Then in the measurement procedure, the position changes are calculated from both calibration and measurement data. In addition, the error induced by manufacture can be reduced or erased in these two procedures. After calibration by a high-accuracy CMM or machine tools, the developed device can also have the same accuracy as these tools. The developed device has been tested using an actual machine tool. The measurement results of the proposed device were checked by other high-accuracy measuring systems, and the comparison showed good agreement.

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