An interaction energy integral method for nonhomogeneous materials with interfaces under thermal loading

作者：Guo Licheng^*; Guo Fengnan; Yu Hongjun; Zhang Li

来源：International Journal of Solids and Structures, 2012, 49(2): 355-365.

DOI：10.1016/j.ijsolstr.2011.10.012

• Nonhomogeneous materials
• Interface
• Interaction energy integral method (IEIM)
• Thermal stress intensity factors (TSIFs)

A plane crack problem of nonhomogeneous materials with interfaces subjected to static thermal loading is investigated. A modified interaction energy integral method (IEIM) is developed to obtain the mixed-mode thermal stress intensity factors (TSIFs). Compared with the previous IEIM, the original point of this paper is: the domain-independence of the modified IEIM still stands in nonhomogeneous materials with interfaces under thermal loading. Therefore, the modified IEIM can still be applied to obtain the TSIFs of nonhomogeneous material even if the integral domain includes interfaces. The modified IEIM is combined with the extended finite element method (XFEM) to solve several thermal fracture problems of nonhomogeneous materials. Good agreement can be obtained compared with the analytic solutions and the domain-independence of the IEIM is verified. Therefore, the present method is effective to study the TSIFs of nonhomogeneous materials even when the materials contain interfaces. The influence of the discontinuity of the material properties (thermal expansion coefficient, thermal conductivity and Young's modulus) on the TSIFs is investigated. The results show that the discontinuity of both thermal expansion coefficient and Young's modulus affects the TSIFs greatly, while the discontinuity of thermal conductivity does not arouse obvious change of the TSIFs. 2011 Elsevier Ltd.

• 出版日期2012-1-15
• 单位哈尔滨工业大学